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  • 17 January 2020 21:41

High Density Interconnect Market Strategic Assessment, Latest Innovations, Drivers, Restraints, Challenges to 2025

The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2018 to 2025.

The Global High Density Interconnect Market is expected to grow from USD 7.9 Billion in 2017 to USD 19.8 Billion by 2025 at a CAGR of 12.2% during the forecast period from 2018-2025. Growing demand for consumer electronics and wearable devices and increase in use of advanced electronics and safety measures in automotive vertical is propelling the demand.

The 10+ Layers HDI segment held the largest market share of 45.60% in 2017

The product segment is classified into 4–6 Layers HDI, 8–10 Layers HDI and 10+ Layers HDI. The 10+ Layers HDI segment is dominating the high density interconnect market in 2017. The 10+ Layers HDIs is widely used in high-reliability automotive products, high-density mobile devices, and IoT modules. 10+ layers HDI also provides small size, lightweight construction and improved flexibility.

Consumer electronics segment valued around USD 2.88 Billion in 2017

End user segment is divided into segments such as automotive, consumer electronics, telecommunication, medical and others. The consumer electronics segment is dominating the market in 2017. Due to miniaturization of size and lower weight, high efficiency and increasing sales, the demand for consumer electronics is high in comparison to other segments.

The wearable devices segment held the largest market share of 28.70% in 2017

Application segment includes automotive electronics, computer and display, communication devices and equipment, Audio/Audiovisual (AV) Devices, connected devices, wearable devices and others. Wearable devices segment is dominating the market in 2017. HDI exhibits technical properties of extremely high density routing interconnections and make the high density of components possible. These characteristics contributes to the high performance and lightweight of HDI boards that make them ideal for powering wearable devices.


Regional Segmentation Analysis:

The market is analysed on the basis of five regions namely North America, Europe, Asia Pacific, South America, and Middle East and Africa. Asia Pacific held the largest market share of approximately 39.40% in 2017. The Asia-Pacific region is dominating due to the rising use of HDI in consumer electronics, automotive and healthcare verticals in countries such as China, India, and South Korea. The expansion of telecommunications networks in China, Thailand, Malaysia, South Korea, India, and other developing countries in APAC has also led to the growth of the region.

Competitive Analysis:

The major players of market include High Density Interconnect market are Unimicron, Compeq Co., TTM Technologies, Austria Technologie & Systemtechnik, Zhen Ding Tech, IBIDEN, MEIKO ELECTRONICS Co., FUJITSU INTERCONNECT TECHNOLOGIES, Tripod Technology Corp, Unitech, SAMSUNG ELECTRO-MECHANICS, Daeduck GDS Co, DAP Corp., Korea Circuit, CMK, NCAB Group, SIERRA CIRCUITS and Multek.

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